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Thermal Management

Heat Sinks are the primary form of Thermal Management solutions used today. Heat Sinks are employed mainly to increase the surface area available for heat transfer from high-power semiconductor devices (e.g., RF Power Transistors, RF Amplifiers, Power Rectifiers, Power Inverter Modules, IGBTs, Thyristor Modules), systematically reducing the device’s external case temperature, as well as its internal junction temperature. In addition to providing four different categories of heat sinks (board-level, bonded-fin, extruded, and liquid cold-plates), Richardson RFPD also supplies clamp compression systems and the various accessories needed to complete a Thermal Management solution.

Richardson RFPD has partnered with the leading suppliers of thermal management solutions to provide an excellent assortment of heat sinks, clamp compression systems, and thermal management accessories.

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Thermal Management