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MADP-0170151314 MACOM Technology Solutions
RF PIN Diode
MFG Part Number: MADP-017015-13140P
  
This device is a silicon, glass PIN diode surmount chip fabricated with MACOM's patented HMIC™ process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producing a surface mount device. This vertical topology provides for exceptional heat transfer. The topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. These protective coatings prevent damage to the junction and the anode air-bridge during handling and assembly.|Applications:|These packageless devices are suitable for usage in moderate incident power, ? 50dBm/C.W. or where the peak power is ? 75dBm, pulse width is ? 1?S, and duty cycle is ? 0.01%. Their low parasitic inductance, 0.4 nH, and excellent RC constant, make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts.
 
Key AttributesValue
Diode ConfigurationSingle Diode
Frequency Range : Minimum Frequency1 MHz
Frequency Range : Maximum Frequency1800 MHz
Vr (Reverse Voltage)-115 VDC
Total Capacitance0.32 pF
Rs (Series Resistance)0.72 Ω
Package TypeODS 1314
Mounting Style
Availability
30000
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This product is available in the following countries:
  • Global
   
MACOM TECHNOLOGY SOLUTIONS