Bonded Fin Heat Sink
Richardson RFPD provides a variety of natural and forced-convection bonded fin heat sink assemblies. They are reliable, cost effective, and highly efficient thermal management solutions for high power and/or densely packaged applications, even in demanding shock and vibration environments. Bonded fin heat sinks are used when the required combination of large heat sink size, tall fins and high fin density make simple extrusions impractical (see extruded heat sink page). A bonded fin heat sink offers increased surface area and lower thermal resistance than a similar sized extrusion and they can be configured in a variety of ways.
Our line of bonded fin heat sinks can be used in every industry employing high-power electronic circuits, including (but not limited to) renewable energy, automotive, telecommunications, broadcast, industrial power, military, RF and wireless, medical equipment, and factory automation. Most of our bonded fin heat sink assemblies are RoHS compliant.
When choosing your bonded fin heat sink, always consider overall dimensions, whether or not it includes flanges (a.k.a. mounting legs), the specified Thermal Resistance (in °C/W), and the finish (gold chromate, clear iridite, gold iridite, unfinished, etc.).
Richardson RFPD is pleased to work with industry-leading manufacturer Wakefield Thermal Solutions to provide our customers with a large selection of bonded fin heat sinks.