With the trend of ever-increasing operating frequencies, push for miniaturization, and reduction in SWaP, it is becoming more common to use bare semiconductor die versus packaged devices in development and production. Bare semiconductor die is available from many suppliers but sometimes with large, minimum order quantities. Richardson RFPD has a dedicated die handling station with ISO Class 6 work-environment, ESD safety, with proper toolset for handling and transferring die to Gel-Pak packaging.

For a listing of die-level semiconductors available with small minimum order increments, please click here.