The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (0.470) and 0.100" grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for all types of surfacemount solder reflow processes. The basic design and internal structure are similar to Teledyne's DPDT 114 Centigrid® relay. The S172D relay has an internal discrete silicon diode for coil transient suppression.