GaN on SiC RF Solutions Enabling Megatrends – 5G, Satellite Communications, Aerospace and Defense

Gallium nitride (GaN) on silicon carbide (SiC) has highest power density across a broad frequency range and plays a pivotal role in providing the best figure of merit for the power amplifier (PA) in terms of linear output power with the benefit of  SWaP-C or size, weight, power and cost.

RF systems need PAs to deliver linear efficient high output power. As systems move to higher-order modulation schemes such as 64/128/256 Quadrature Amplitude Modulation (QAM), they also must deliver high linearity and efficiency in denser environments with stringent peak-to-average power ratio (PAPR). A new generation of GaN on SiC Monolithic Microwave Integrated Circuits (MMIC) PAs offers a solution to these challenges with highest power density to generate high linear output power with high efficiency.

RF applications need beamforming with different types of phased array beamforming architectures from analog beamforming, digital beamforming, hybrid beamforming along with metamaterial beamforming. The webinar will explain trade-offs between them.

This webinar also explores performance advances in GaN MMIC PAs applied to advanced radar technology, linear power SatCom uplinks, 5G and wideband PA applications. It discusses GaN on SiC MMIC power attributes that are critical to improving and offering more compelling next-generation products for 5G, Aerospace and Defense and SatCom applications.

Key Takeaways

• Discover how to meet linearity specs for high order modulations used in 5G and satellite communications.
• Learn about cost effective beamforming for 5G using Varactors
• Explore ways to deliver higher power for avionics and L Band radar systems using GaN on SiC
• Achieve higher efficiencies for your radar systems
• Drive wider bandwidths for your MILCOM radio systems

Speakers

Baljit Chandhoke, Product Manager, Microchip

Baljit Chandhoke is the Product Manager for Microchip’s industry-leading portfolio of RF products. He has more than 15 years of product line management experience in customer facing roles-leading teams in defining new products, competitive positioning, driving design wins, revenue and go-to-market strategies across wireless infrastructure, mobility (5G), aerospace and defense market segments. He has authored multiple articles in leading industry publications, presented in several conferences, consortiums, YouTube videos, webinars on RF technologies and trends. Prior to joining Microchip, Baljit Chandhoke worked in leadership positions at GlobalFoundries, Renesas (IDT), ON Semiconductor, Cypress Semiconductor. He has a Master’s in Business Administration (M.B.A) from Arizona State University, M.S. in Telecommunications from University of Colorado Boulder and Bachelors in Electronics and Telecommunications Engineering from University of Mumbai, India.

Mike Ziehl, Manager, Product Marketing, Microchip

Mike Ziehl has more than 25 years of engineering, marketing and general management experience in the semiconductor business. He and his teams have launched innovative products that opened new market segments; driving design wins, revenue and growth in the mobility (5G), wireless infrastructure, aerospace and defense and industrial market segments. He has authored multiple articles in leading industry publications, and spoken at numerous industry events, panels and webinars. Prior to joining Microchip, Mike Ziehl worked in the RF semiconductor industry in leadership positions at Macom, NXP and Hittite Microwave. He holds a Master’s in Business Administration (M.B.A) from Rensselaer Polytechnic Institute and a BSEE from Fairfield University.