Fibocom to Be The First in Providing Engineering Samples of 5G Module Based on MediaTek Chipset Platform
Fibocom releases its latest 5GLGA module FG360 during the CES 2021 event. The module is based on the MediaTek chipset platform and will be available in two versions. FG360-EAU will be launched for EMEA/APAC markets, and FG360-NA will be launched for the North American market.
FG360 is a 5G module with high integration, high data rate and great cost performance. It is designed based on MediaTek’sT750 chipset platform which adopts a 7nm compact design with a 5G NR FR1 modem, a quad-core Arm Cortex-A55 processor and rich essential peripherals all integrated on a single chipset. Through a high degree of integration, the FG360module enables customers to design their products with the best performance and the most optimal cost.
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