Fibocom releases its latest 5GLGA module FG360 during the CES 2021 event. The module is based on the MediaTek chipset platform and will be available in two versions. FG360-EAU will be launched for EMEA/APAC markets, and FG360-NA will be launched for the North American market.

FG360 is a 5G module with high integration, high data rate and great cost performance. It is designed based on MediaTek’sT750 chipset platform which adopts a 7nm compact design with a 5G NR FR1 modem, a quad-core Arm Cortex-A55 processor and rich essential peripherals all integrated on a single chipset. Through a high degree of integration, the FG360module enables customers to design their products with the best performance and the most optimal cost.