Wakefield Thermal‘s heat sinks provide an extensive range of natural convection solutions for higher power components and systems.
Complex fin structures can be created by forcing raw aluminum through an extrusion die. These complex fin profiles allow greater heat dissipation through increased surface area while eliminating the cost and time associated with machining an equivalent shape from block aluminum.
Advantages: Wakefield Thermal Extruded Aluminum Heat Sinks
Efficient
Greater efficiency than stamped heat sinks
Cost-Effective
Lower cost than fully-machined assemblies
Customizable
Easily customized for any application
Available in many Sizes
Available in-stock from Richardson RFPD in many standard shapes and sizes
Weight Advantage
Significant weight advantage over copper
Heat Sinks - Profiles
H-Style
Increased surface area leads to better heat dissipation, and its distinctive shape can be optimized to fit specific space and airflow requirements.
Press Pack
High thermal efficiency due to direct clamping mechanism, ensuring minimal thermal resistance between the high-power semiconductor device and the heat sink.
Flatback
Versatile design allows for easy mounting against flat surfaces, providing effective thermal management in compact and confined spaces.
Flatback High Fin
Combine the easy mounting capabilities of flatback designs with the enhanced cooling performance of high fin structures.
