Microsemi SiC Schottky diode modules offer industry-leading integration and package. Shrink system size and weight, while reducing total system costs.
- Key Features
- Essentially zero forward and reverse recovery = reduced switch and diode switching losses
- Temperature independent switching behavior = stable high temperature performance
- Positive temperature coefficient of VF = ease of parallel operation
- Usable 175oC junction temperature = safely operate at higher temperatures
Microsemi Featured Products
Part Number | Configuration | VDS (V) VCE (V) VRRM (V) | Rds(on) (mW) VCEsat (V) VF (V) | Current (A) Tc=80 C | Package | MSCDC200H120AG | Full Bridge | 1200 | 1.5 | 200 | SP6C |
---|---|---|---|---|---|
MSCDC50H1201AG | Full Bridge | 1200 | 1.5 | 50 | SP1 |
MSCDC600A120AG | Phase leg | 1200 | 1.5 | 600 | SP6C |
MSCDC200A120D1PAG | Phase leg | 1200 | 1.5 | 200 | D1P |
MSCDC200KK120D1PAG | Dual Common Cathode | 1200 | 1.5 | 200 | D1P |
MSCDC50X1201AG | 3 phase bridge | 1200 | 1.5 | 50 | SP1 |
MSCDC200H70AG | Full Bridge | 700 | 1.5 | 200 | SP6C |
MSCDC50H701AG | Full Bridge | 700 | 1.5 | 50 | SP1 |
MSC50DC70HJ | Full Bridge | 700 | 1.5 | 50 | SOT227 |
MSCDC600A70AG | Phase leg | 700 | 1.5 | 600 | SP6C |
MSCDC200A70D1PAG | Phase leg | 700 | 1.5 | 200 | D1P |
MSCDC200KK70D1PAG | Dual Common Cathode | 700 | 1.5 | 200 | D1P |
MSCDC50X701AG | 3 phase bridge | 700 | 1.5 | 50 | SP1 |