Top-side cooled power semiconductors are gaining interest across the power electronics design community. Improved thermal management, design flexibility and simplified assembly are among the benefits of designing with top-side cooled devices. In this Tech Chat, those benefits are applied to Wolfspeed’s portfolio of silicon carbide top-side cooled MOSFETs.
Related Content
Richardson RFPD Introduces Wolfspeed Gen 4 MOSFETs Delivering Next-Generation Efficiency and Real-World Performance
We’re excited to expand access to Wolfspeed’s Gen 4 SiC MOSFET platform—delivering higher efficiency, easier…
Wolfspeed Gen 4 MOSFETs: Powering Real-World Performance with Next-Gen Efficiency
Wolfspeed has unveiled its Gen 4 technology platform—engineered to deliver breakthrough performance, durability, and efficiency for high-power applications.
Designing with Top Side Cooled (TSC) Silicon Carbide Power Devices
Wolfspeed is now expanding system design options by commercially releasing a well-
known top-side cooled package to both automotive and industrial markets.
