Designing with Top Side Cooled (TSC) Silicon Carbide Power Devices

Designing with Top Side Cooled (TSC) Silicon Carbide Power Devices

September 26, 2025

Silicon Carbide

Designers of high-voltage systems are turning to silicon carbide for its intrinsic temperature and switching performance behaviors across a growing list of power electronics applications. Engineers often face multi-faceted system design requirements, including the need for multi-sourced packages capable of supporting tight power density constraints with limited thermal dissipation design possibilities.

Wolfspeed is now expanding system design options by commercially releasing a well-known top-side cooled package to both automotive and industrial markets. As a drop-in replacement for MOSFETs produced by other suppliers, the U2 package enables procurement flexibility for established designs with improved package creepage to support designs from 650 V – 1200 V.

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