New SiC Module Boosting the Efficiency of Power Applications

New SiC Module Boosting the Efficiency of Power Applications

September 5, 2021

Silicon Carbide, Silicon Carbide Power Modules

The module was developed over the last ten years, with requirements coming from traction OEMs. It delivers in terms of having a half-bridge topology, the lowest stray inductance in its class and the highest power density. With the separation of the DC plus and minus and AC terminals, and a lower profile for the gate connection, a remarkably simple and compact design for an inverter can be realized. When compared to the already established high-power IGBT isolated modules, like the HiPak (Figure 1), the LinPak is a smaller module, enabling better scalability in power for inverter designs.

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