The module was developed over the last ten years, with requirements coming from traction OEMs. It delivers in terms of having a half-bridge topology, the lowest stray inductance in its class and the highest power density. With the separation of the DC plus and minus and AC terminals, and a lower profile for the gate connection, a remarkably simple and compact design for an inverter can be realized. When compared to the already established high-power IGBT isolated modules, like the HiPak (Figure 1), the LinPak is a smaller module, enabling better scalability in power for inverter designs.
Agreement includes complete lineup of power semiconductor devices