Wolfspeed has unveiled its Gen 4 technology platform—engineered to deliver breakthrough performance, durability, and efficiency for high-power applications.

Wolfspeed is now expanding system design options by commercially releasing a well- known top-side cooled package to both automotive and industrial markets.

Couldn’t attend in person? You can still explore products and solutions presented at our booth.

SiC reference design targeting high power applications such as cold-ironing for the reduction of emissions and form factor in shore-to-ship power systems.

Missed the in-person event? Don’t worry—you can still explore the power products and design resources showcased at our PCIM 2025 booth!

The 2300 V three-phase inverter reference design demonstrates the design simplicity and scalability of Wolfspeed’s new 2300 V baseplate-less SiC power modules.

Our field application engineers and technical sales team will be there to assist you in exploring the full range of active, passive, and thermal products offered from Richardson RFPD.

This white paper highlights Wolfspeed’s fourth-generation silicon carbide (SiC) MOSFET technology, engineered for high-power electronics applications.

Top-side cooled power semiconductors are gaining interest across the power electronics design community. Improved thermal…

Electronic devices that are in proximity or share common conductors are susceptible to electromagnetic interference (EMI)…