Wolfspeed has unveiled its Gen 4 technology platform—engineered to deliver breakthrough performance, durability, and efficiency for high-power applications.

Wolfspeed is now expanding system design options by commercially releasing a well- known top-side cooled package to both automotive and industrial markets.

Couldn’t attend in person? You can still explore products and solutions presented at our booth.

SiC reference design targeting high power applications such as cold-ironing for the reduction of emissions and form factor in shore-to-ship power systems.

The 2300 V three-phase inverter reference design demonstrates the design simplicity and scalability of Wolfspeed’s new 2300 V baseplate-less SiC power modules.

This white paper highlights Wolfspeed’s fourth-generation silicon carbide (SiC) MOSFET technology, engineered for high-power electronics applications.

Top-side cooled power semiconductors are gaining interest across the power electronics design community. Improved thermal…

Electronic devices that are in proximity or share common conductors are susceptible to electromagnetic interference (EMI)…

In this Tech Chat, we discuss how EMI emissions of Silicon Carbide compare to Silicon and the advantages Wolfspeed’s SiC modules offer to compensate for these emissions.

Wolfspeed has launched a baseplate-less module family to meet the requirements of medium power applications, providing solutions across the power electronics continuum.