New flow S3 Mid-Power Package – the Smarter Way

Engineers aim for higher power ratings, increased power density and, ultimately, more power in the same frame size. An increase of ceramic substrate size to accommodate the required semiconductors for higher power rating, while keeping a small package footprint, is the key. The sweet spot comes by lack of a copper baseplate and by lack of system solder, which results in reduced cost and increased reliability. A new baseplate-less package with single big ceramic substrate will be introduced in this article.